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TMP32C6411ZLZ Datasheet(PDF) 117 Page - Texas Instruments |
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TMP32C6411ZLZ Datasheet(HTML) 117 Page - Texas Instruments |
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117 / 119 page ![]() MECHANICAL DATA MPBG175B − OCTOBER 2000 − REVISED FEBRUARY 2002 1 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 GLZ (S-PBGA-N532) PLASTIC BALL GRID ARRAY 0,80 0,12 M 0,10 4201884/C 11/01 1,00 NOM Seating Plane 0,55 0,45 A 20,00 TYP 0,35 0,45 22,90 23,10 SQ 2 B 3,30 MAX Heat Slug 1 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 C D E F G H J K L M N P R T U V W Y AA AB AC AD AE AF 0,40 Bottom View A1 Corner NOTES: A. All linear dimensions are in millimeters. B. This drawing is subject to change without notice. C. Thermally enhanced plastic package with heat slug (HSL) D. Flip chip application only |
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