TMP32C6411ZLZ datasheet(116/119 Pages) TI

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TMS320C6411

FIXEDPOINT DIGITAL SIGNAL PROCESSOR

SPRS196H − MARCH 2002 − REVISED JULY 2004

116

POST OFFICE BOX 1443

• HOUSTON, TEXAS 77251−1443

MECHANICAL DATA

The following table(s) show the thermal resistance characteristics for the PBGA — GLZ and ZLZ mechanical

packages.

thermal resistance characteristics (S-PBGA package) [GLZ]

NO.

°C/W

Air Flow (m/s†)

ΘJC

Junction-to-case

1.55

N/A

ΘJB

Junction-to-board

9.1

N/A

ΘJA

Junction-to-free air

17.9

0.00

ΘJA

Junction-to-free air

15.02

0.5

ΘJA

Junction-to-free air

13.4

1.0

ΘJA

Junction-to-free air

11.89

2.00

PsiJT

Junction-to-package top

0.5

N/A

PsiJB

Junction-to-board

7.4

N/A

† m/s = meters per second

thermal resistance characteristics (S-PBGA package) [ZLZ]

NO.

°C/W

Air Flow (m/s†)

ΘJC

Junction-to-case

1.55

N/A

ΘJB

Junction-to-board

9.1

N/A

ΘJA

Junction-to-free air

17.9

0.00

ΘJA

Junction-to-free air

15.02

0.5

ΘJA

Junction-to-free air

13.4

1.0

ΘJA

Junction-to-free air

11.89

2.00

PsiJT

Junction-to-package top

0.5

N/A

PsiJB

Junction-to-board

7.4

N/A

† m/s = meters per second

The following mechanical package diagram(s) reflect the most up-to-date mechanical data released for these

designated device(s).

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