AXP313A

版权所有©深圳芯智汇科技有限公司。保留一切权利

3

目录

1

特性......................................................................................................................................................................................1

2

应用......................................................................................................................................................................................1

3

概述......................................................................................................................................................................................1

版本历史..................................................................................................................................................................................2

目录..........................................................................................................................................................................................3

图片目录..................................................................................................................................................................................5

表格目录..................................................................................................................................................................................6

4

管脚配置和功能.................................................................................................................................................................7

5

规格......................................................................................................................................................................................9

5.1

极限参数(1)...............................................................................................................................................................9

5.2 ESD

等级....................................................................................................................................................................9

5.3

推荐工作条件..........................................................................................................................................................9

5.4

热阻参数................................................................................................................................................................10

5.5

电气参数................................................................................................................................................................10

6

详细描述...........................................................................................................................................................................13

6.1

概述........................................................................................................................................................................13

6.2

结构框图................................................................................................................................................................14

6.3 TWSI

通信................................................................................................................................................................15

6.4

工作模式和复位....................................................................................................................................................15

6.5

多路电源输出........................................................................................................................................................18

6.6

中断........................................................................................................................................................................19

6.7

寄存器....................................................................................................................................................................19

6.7.1

寄存器列表.................................................................................................................................................19

6.7.2

寄存器描述.................................................................................................................................................20

7

应用信息...........................................................................................................................................................................26

7.1 DCDC/LDO

设计......................................................................................................................................................26

7.2

设计........................................................................................................................................................................26

7.3

典型应用................................................................................................................................................................27

8 PCB Layout.......................................................................................................................................................................... 28

9

封装，运输，储存和烘烤信息.......................................................................................................................................29

9.1

封装........................................................................................................................................................................29