AXP313A

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10

5.4

热阻参数

表 5-4 热阻参数

Thermal Metric(1)

VALUE

UNIT

θJA

Junction-to-ambient thermal resistance

32.6

℃/W

θJB

Junction-to-board thermal resistance

6.82

θJC

Junction-to-case(top) thermal resistance

12.32

(1)Thermal metrics are calculated refer to JEDEC document JESD51. The values are based on simulation.

5.5

电气参数

VIN =5V

，TA=-40℃~85℃

表 5-5 电气参数

SYMBOL

DESCRIPTION

CONDITIONS

MIN

TYP

MAX

UNIT

PMIC Under Voltage

VOFF

PMIC Under Voltage Power

off

2.6

V

Off Mode Current

IOFF

OFF Mode Current

VIN=5V

10

μA

TWSI

VCC

Input Supply Voltage

1.8

3.3

V

ADDRESS

TWSI Slave Address (7 bits)

0x36/

0x37

fSCK

Clock Operating Frequency

0.4

MHz

VIL

SCK/SDA Logic Low Voltage

0.3VC

C

V

VIH

SCK/SDA Logic Low Voltage

0.7VCC

MHz

DCDC

fOSC

Oscillator Frequency

Default

3

MHz

DCDC1

VIN1

VIN1 Input Voltage

VOFF

5.5

V

IDC1OUT

Available Output Current

1500

mA

VDC1OUT

Output Voltage Range

0.5

3.4

V

VDC1_STEP

Output Voltage Step

VDC1OUT=0.5~1.2V

10

mV/

step

VDC1OUT=1.22~1.54V

20

VDC1OUT=1.6~3.4V

100

VDC1_ACC

Output Voltage Accuracy

PWM

Mode,VDC1OUT<1V

±30

mV

PWM

Mode,VDC1OUT>1V

±3%

VDC1_OVP

Over Voltage Protection

120%*

VDC1OUT

V

VDC1_UVP

Under Voltage Protection

85%*

VDC1OUT

V