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TGF2953 Datasheet(PDF) 19 Page - TriQuint Semiconductor |
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TGF2953 Datasheet(HTML) 19 Page - TriQuint Semiconductor |
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19 / 21 page ![]() TGF2953 12 Watt Discrete Power GaN on SiC HEMT Datasheet: Rev A 10-22-14 - 19 of 21 - Disclaimer: Subject to change without notice © 2014 TriQuint www.triquint.com Mechanical Drawing Bond Pads Pad No. Description Dimensions 1, 2 Gate 0.125 x 0.125 3 Drain 0.150 x 0.564 Die Backside Source / Ground 1.007 x 1.139 1. Units: millimeters 2. Thickness: 0.100 mm 3. Die xy size tolerance: ± 0.050 mm Reference Planes |
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