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AXP313A Datasheet(PDF) 32 Page - Shenzhen X-Powers Technology Co ., Ltd |
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AXP313A Datasheet(HTML) 32 Page - Shenzhen X-Powers Technology Co ., Ltd |
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32 / 33 page ![]() AXP313A 版权所有©深圳芯智汇科技有限公司。保留一切权利 32 10 回流焊曲线 本文推荐的回流焊曲线是一种无铅回流焊曲线,适用于无铅焊膏的纯无铅技术。 图 10-1AXP313A典型回流焊曲线 AXP313A 的回流焊曲线条件如表10-1所示。 表 10-1AXP313A回流焊曲线条件 QTI typical SMT reflow profile conditions (for reference only) Step Reflow condition Environment N2 purge reflow usage (yes/no) Yes, N2 purge used If yes, O2 ppm level O2 < 1500 ppm A Preheat ramp up temperature range 25 ℃ ->150℃ B Preheat ramp up rate 1.5~2.5 ℃/sec C Soak temperature range 150 ℃ ->190℃ D Soak time 80~110 sec E Liquidus temperature 217 ℃ F Time above liquidus 60-90 sec G Peak temperature 240-250 ℃ H Cool down temperature rate ≤4℃/sec |
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