SPC560P50L3 datasheet(56/112 Pages) STMICROELECTRONICS

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Electrical characteristics

SPC560P44Lx, SPC560P50Lx

56/112

Doc ID 14723 Rev 9

The SPC560P44Lx, SPC560P50Lx supply architecture allows the ADC supply to be

managed independently from the standard VDD_HV supply. Figure 8 shows the constraints

of the ADC power supply.

Figure 8.

Independent ADC supply (3.0 V

≤ VDD_HV_REG ≤ 5.5 V)

3.5

Thermal characteristics

3.5.1

Package thermal characteristics

5.5 V

3.0 V

VDD_HV_REG

3.0 V

5.5 V

VDD_HV_ADCx

Table 12.

Thermal characteristics for 144-pin LQFP

Symbol

Parameter

Conditions

Typical

value

Unit

RθJA

Thermal resistance junction-to-ambient,

natural convection(1)

Junction-to-ambient thermal resistance determined per JEDEC JESD51-7. Thermal test board meets

JEDEC specification for this package.

Single layer board—1s

54.2

°C/

Four layer board—

2s2p

44.4

°C/

RθJB

Thermal resistance junction-to-board(2)

Four layer board—

2s2p

29.9

°C/

RθJCtop

Thermal resistance junction-to-case

(top)(3)

Single layer board—1s

9.3

°C/

ΨJB

Junction-to-board, natural convection(4)

Operating conditions

30.2

°C/

ΨJC

Junction-to-case, natural convection(5)

Operating conditions

0.8

°C/

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