UCD7201

SLUS645F – FEBRUARY 2005 – REVISED DECEMBER 2014

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7 Specifications

7.1 Absolute Maximum Ratings

(1) (2)

MIN

MAX

UNIT

Supply Voltage

16

V

Quiescent

20

Supply Current

mA

200

Output Gate Drive

OUT

–1

PVDD

V

Voltage

4.0

)

Output Gate Drive

OUT

A

Current

–4.0

ce)

ISET, CS

–0.3

3.6

Analog Input

ILIM

–0.3

3.6

V

Digital I/O’s

IN, CLF

–0.3

3.6

Power Dissipation

2.67

W

Junction Operating

UCD7201

–55

150

°C

Temperature

(1)

Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings

only, and functional operation of the device at these or any other conditions beyond those indicated under “recommended operating

conditions” is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2)

All voltages are with respect to GND. Currents are positive into, negative out of the specified terminal.

7.2 Handling Ratings

MIN

MAX

UNIT

Storage temperature range

–65

150

°C

Human body model (HBM), per ANSI/ESDA/JEDEC JS-001, all

2000

Electrostatic discharge

V

Charged device model (CDM), per JEDEC specification

500

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2)

JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

7.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

MIN

TYP

MAX

UNIT

Supply Voltage, VDD

4.25

12

14.5

V

Supply bypass capacitance

1

μF

Reference bypass capacitance

0.22

Operating junction temperature

–40

105

°C

7.4 Thermal Information

UCD7201

PWP

UNIT

14 PINS

Junction-to-ambient thermal resistance

50.7

Junction-to-case (top) thermal resistance

31.8

Junction-to-board thermal resistance

27.8

°C/W

Junction-to-top characterization parameter

1.2

Junction-to-board characterization parameter

27.6

Junction-to-case (bottom) thermal resistance

4.1

(1)

For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.

4

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