320 datasheet(63/82 Pages) INTEL

63 / 82 page

Datasheet

Thermal Specifications and Design Considerations

Thermal Specifications and

Design Considerations

5.1

Processor Thermal Specifications

The Celeron D processor requires a thermal solution to maintain temperatures within operating

limits as set forth in Section 5.1.1. Any attempt to operate the processor outside these operating

limits may result in permanent damage to the processor and potentially other components within

the system. As processor technology changes, thermal management becomes increasingly crucial

when building computer systems. Maintaining the proper thermal environment is key to reliable,

long-term system operation.

A complete thermal solution includes both component and system level thermal management

features. Component level thermal solutions can include active or passive heatsinks attached to the

processor Integrated Heat Spreader (IHS). Typical system level thermal solutions may consist of

system fans combined with ducting and venting.

For more information on designing a component level thermal solution, refer to the applicable

thermal design guide.

Note:

The boxed processor will ship with a component thermal solution. Refer to Chapter 7 for details on

the boxed processor.

5.1.1

Thermal Specifications

To allow for the optimal operation and long-term reliability of Intel processor-based systems, the

system/processor thermal solution should be designed such that the processor remains within the

minimum and maximum case temperature (TC) specifications when operating at or below the

Thermal Design Power (TDP) value listed per frequency in Table 5-1. Thermal solutions not

designed to provide this level of thermal capability may affect the long-term reliability of the

processor and system. For more details on thermal solution design, refer to the appropriate

processor thermal design guidelines.

The Celeron D processor introduces a new methodology for managing processor temperatures

through fan speed control. Selection of the appropriate fan speed will be based on the temperature

reported by the processor’s Thermal Diode. The fan must be turned on to full speed when TDIODE

is at or above TCONTROL and TC must be maintained at or below TC (max) as defined by the

processor thermal specifications in Table 5-1. The fan speed may be lowered when the processor

temperature can be maintained below TCONTROL as measured by the thermal diode. Systems

implementing fan speed control must be designed to read temperature values from the diode and

TCONTROL register and take appropriate action. Systems that do not alter the fan speed (always at

full speed) only need to guarantee the case temperature meets specifications in Table 5-1.

The case temperature is defined at the geometric top center of the processor IHS. Analysis

indicates that real applications are unlikely to cause the processor to consume maximum power

dissipation for sustained periods of time. Intel recommends that complete thermal solution designs

target the Thermal Design Power (TDP) indicated in Table 5-1 instead of the maximum processor

320 Datasheet(PDF) 63 Page - Intel Corporation

320 Datasheet(HTML) 63 Page - Intel Corporation

Html Pages

1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50 51 52 53 54 55 56 57 58 59 60 61 62 63 64 65 66 67 68 69 70 71 72 73 74 75 76 77 78 79 80 81 82

Datasheet Descarga

Enlace URL