320 datasheet(12/82 Pages) INTEL

12 / 82 page

Datasheet

Introduction

1.1.1

Processor Packaging Terminology

Commonly used terms are explained here for clarification:

• Intel® Celeron® D processor on 90 nm process and in the 478-pin package — Celeron D

processor in the FC-mPGA4 package with a 256-KB L2 cache.

• Processor — For this document, the term processor is the generic form of the Celeron D

processor.

• Keep-out zone — The area on or near the processor that system design can not use.

• Intel£ 865G/865GV/865PE/865P chipset — Chipset that supports DDR memory technology

for the Celeron D processor.

• Intel® 845G chipset — Chipset with embedded graphics that supports DDR memory

technology. Changes are required to support the Celeron D processor on 90 nm micron

process.

• Intel® 852 GME/PM/GMV chipsets — Intel’s Portability chipsets that support DDR

memory technology for the Celeron D processor

• Processor core — Processor core die with integrated L2 cache.

• FC-mPGA4 package — The Celeron D processor is available in a Flip-Chip Micro Pin Grid

Array 4 package, consisting of a processor core mounted on a pinned substrate with an

integrated heat spreader (IHS). This packaging technology employs a 1.27 mm [0.05 in] pitch

for the substrate pins.

• mPGA478B socket — The Celeron D processor mates with the system board through a

surface mount, 478-pin, zero insertion force (ZIF) socket.

• Integrated heat spreader (IHS) —A component of the processor package used to enhance

the thermal performance of the package. Component thermal solutions interface with the

processor at the IHS surface.

• Retention mechanism (RM)—Since the mPGA478B socket does not include any mechanical

features for heatsink attach, a retention mechanism is required. Component thermal solutions

should attach to the processor via a retention mechanism that is independent of the socket.

320 Datasheet(PDF) 12 Page - Intel Corporation