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Package Mechanical Specifications

3.4

Package Handling Guidelines

Table 3-2 includes a list of guidelines on package handling in terms of recommended maximum

loading on the processor IHS relative to a fixed substrate. These package handling loads may be

experienced during heatsink removal.

3.5

Package Insertion Specifications

The Celeron D processor can be inserted into and removed from a mPGA478B socket 15 times.

The socket should meet the mPGA478B requirements detailed in the mPGA479, mPGA478A,

mPGA478B, mPGA478C, and mPGA476 Socket Design Guidelines.

3.6

Processor Mass Specification

The typical mass of the Celeron D processor is 19 g [0.67 oz]. This mass [weight] includes all the

components that are included in the package.

3.7

Processor Materials

Table 3-3 lists some of the package components and associated materials.

Table 3-2. Package Handling Guidelines

Parameter

Maximum Recommended

Notes

Shear

356 N [80 lbf]

1,2

NOTES:

A shear load is defined as a load applied to the IHS in a direction parallel to the IHS top surface.

These guidelines are based on limited testing for design characterization.

Tensile

156 N [35 lbf]

2,3

A tensile load is defined as a pulling load applied to the IHS in a direction normal to the IHS surface.

Torque

8 N-m [70 lbf-in]

2,4

A torque load is defined as a twisting load applied to the IHS in an axis of rotation normal to the IHS top sur-

face.

Table 3-3. Processor Materials

Component

Material

Integrated Heat Spreader (IHS)

Nickel Plated Copper

Substrate

Fiber Reinforced Resin

Substrate Pins

Gold Plated Copper

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