MPC5634MF0MMGA6 datasheet(63/118 Pages) FREESCALE

63 / 118 page

Electrical characteristics

MPC5634M Microcontroller Data Sheet, Rev. 4

Preliminary—Subject to Change Without Notice

Freescale Semiconductor

To determine the junction temperature of the device in the application on a prototype board, use the thermal characterization

parameter (

ΨJT) to determine the junction temperature by measuring the temperature at the top center of the package case using

the following equation:

TJ = TT + (ΨJT x PD)

Eqn. 4

where:

= thermocouple temperature on top of the package (oC)

ΨJT

= thermal characterization parameter (oC/W)

= power dissipation in the package (W)

The thermal characterization parameter is measured in compliance with the JESD51-2 specification using a 40-gauge type T

thermocouple epoxied to the top center of the package case. Position the thermocouple so that the thermocouple junction rests

on the package. Place a small amount of epoxy on the thermocouple junction and approximately 1 mm of wire extending from

the junction. Place the thermocouple wire flat against the package case to avoid measurement errors caused by the cooling

effects of the thermocouple wire.

References:

Semiconductor Equipment and Materials International

3081 Zanker Road

San Jose, CA 95134

USA

(408) 943-6900

MIL-SPEC and EIA/JESD (JEDEC) specifications are available from Global Engineering Documents at 800-854-7179 or

303-397-7956.

JEDEC specifications are available on the web at http://www.jedec.org.

•

C.E. Triplett and B. Joiner, “An Experimental Characterization of a 272 PBGA Within an Automotive Engine

Controller Module,” Proceedings of SemiTherm, San Diego, 1998, pp. 47-54.

•

G. Kromann, S. Shidore, and S. Addison, “Thermal Modeling of a PBGA for Air-Cooled Applications”, Electronic

Packaging and Production, pp. 53-58, March 1998.

•

B. Joiner and V. Adams, “Measurement and Simulation of Junction to Board Thermal Resistance and Its Application

in Thermal Modeling,” Proceedings of SemiTherm, San Diego, 1999, pp. 212-220.

MPC5634MF0MMGA6 Datasheet(PDF) 63 Page - Freescale Semiconductor, Inc