HIP2103-4DEMO2Z datasheet(28/31 Pages) RENESAS

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HIP2103, HIP2104

10. Package Outline Drawings

FN8276 Rev.2.0

Page 28 of 30

Feb 25, 2021

10. Package Outline Drawings

L8.3x3A

8 Lead Thin Dual Flat No-Lead Plastic Package (TDFN)

Rev 5, 5/15

located within the zone indicated. The pin #1 identifier may be

Unless otherwise specified, tolerance: Decimal ± 0.05

The configuration of the pin #1 identifier is optional, but must be

between 0.15mm and 0.20mm from the terminal tip.

Dimension applies to the metallized terminal and is measured

Dimensions in ( ) for Reference Only.

Dimensioning and tolerancing conform to ASME Y14.5m-1994.

either a mold or mark feature.

Dimensions are in millimeters.

NOTES:

BOTTOM VIEW

DETAIL "X"

SIDE VIEW

TYPICAL RECOMMENDED LAND PATTERN

TOP VIEW

0 . 2 REF

0 . 05 MAX.

0 . 02 NOM.

3.00

(4X)

0.15

PIN 1

INDEX AREA

PIN #1

6X 0.65

1.50 ±0.10

8X 0.30 ± 0.10

0.75 ±0.05

SEE DETAIL "X"

0.08

0.10

( 2.90 )

(1.50)

( 8 X 0.30)

( 8X 0.50)

( 2.30)

( 1.95)

2.30 ±0.10

0.10

8X 0.30 ±0.05

2X 1.950

(6x 0.65)

INDEX AREA

PIN 1

Compliant to JEDEC MO-229 WEEC-2 except for the foot length.

Tiebar shown (if present) is a non-functional feature and may be

located on any of the 4 sides (or ends).

For the most recent package outline drawing, see L8.3x3A.

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