PCF8811USLASH2DASLASH1 datasheet(77/81 Pages) NXP

77 / 81 page

PCF8811_4

Product data sheet

Rev. 04 — 27 June 2008

77 of 81

NXP Semiconductors

PCF8811

80 x 128 pixels matrix LCD driver

The orientation of the IC in a pocket is indicated by the position of the IC type name on the

die surface with respect to the chamfer on the upper left corner of the tray. Refer to the

bonding pad location diagram (Figure 2) for the orientation and position of the type name

on the die surface.

22. Abbreviations

Fig 56. Tray alignment

mgw771

PCF8811

Table 43.

Abbreviations

Acronym

Description

CDM

Charged Device Model

CMOS

Complementary Metal Oxide Semiconductor

COG

Chip-On-Glass

DDRAM

Double Data Random Access Memory

ESD

ElectroStatic Discharge

HBM

Human Body Model

High Voltage

Integrated Circuit

ITO

Indium Tin Oxide

LCD

Liquid Crystal Display

LSB

Least Signiﬁcant Bit

Machine Model

MRA

Multiple Row Addressing

MSB

Most Signiﬁcant Bit

MPU

MicroProcessing Unit

OTP

One Time Programmable

RAM

Read Access Memory

SPI

Serial Peripheral Interface

Temperature Coefﬁcient

TCP

Tape Carrier Packages

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