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ADP5020ACPZ-R7 Datasheet(PDF) 24 Page - Analog Devices

No. de pieza ADP5020ACPZ-R7
Descripción Electrónicos  Power Management Unit for Imaging Modules
PDF  28 Pages
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ADP5020ACPZ-R7 Datasheet(HTML) 24 Page - Analog Devices

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ADP5020
Rev. 0 | Page 24 of 2
8
PCB BOARD LAYOUT RECOMMENDATIONS
Place the input and output capacitors, C1, C2, C3, C4, and
C5, as close as possible to the respective ADP5020 pin, and
make the grounding connection to the ADP5020 ground
pins as short as possible.
Connect C3, C5, and C6 to the analog ground, and connect
C1, C2, and C4 to the power ground.
Place the L1 and L2 inductors as close as possible to the
respective output pins.
The power and analog ground planes are recommended to
keep the noise low. Use one layer for power ground and one
layer for analog ground. Tie the power and analog grounds
at a single point.
Use wide traces to connect the inductor and the input and
output capacitors.
Add the L3 inductor and the C8 capacitor, if needed, to
improve the LDO noise rejection at the switching fre-
quency of the Buck 1 regulator (3 MHz) because the LDO
PSRR typically degrades at higher frequencies. If switching
noise is not an issue, remove the L3 inductor.
EXTERNAL COMPONENT LIST
Table 19. Recommended External Components List
Reference
Designator
Description
Size
Proposed Vendor
Vendor Part No.
C1, C4
10 μF, X5R, 6.3 V, ±20%
0603
Murata
GRM188R60J106M
C1, C4
10 μF, X5R, 6.3 V, ±20%
0603
Taiyo Yuden
JMK107BJ106MA
C2
4.7 μF, X5R, 6.3 V, ±10%
0603
Murata
GRM188R60J475K
C3
1.0 μF, X5R, 6.3 V, ±10%
0603
Murata
GRM155R60J105K
C5
0.1 μF, X5R, 10 V, ±10%
0402
Murata
GRM155R61A104K
C6
1.0 μF, X5R, 6.3 V, ±10%
0603
Murata
GRM155R60J105K
L1
2.2 μH, DCR = 0.13 Ω, IDC = 1 A
2.5 mm × 1.8 mm × 1.2 mm
Taiyo Yuden
BRL2518T2R2M
L2
2.2 μH, DCR = 0.23 Ω, IDC = 0.53 A
2.0 mm × 1.2 mm × 1.0 mm
Taiyo Yuden
BRL2012T2R2M
R1, R2
10 kΩ, 1%, thick film resistor
0402
KOA Speer Electronics
RK73H1ETTP1002F



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