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TBD Datasheet(PDF) 75 Page - Freescale Semiconductor, Inc |
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TBD Datasheet(HTML) 75 Page - Freescale Semiconductor, Inc |
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75 / 80 page ![]() Ordering Information MSC8144E Quad Core Digital Signal Processor Data Sheet, Rev. 6 Freescale Semiconductor 75 4 Ordering Information Consult a Freescale Semiconductor sales office or authorized distributor to determine product availability and place an order. 5 Package Information Part Package Type Spheres Core Voltage Operating Temperature Core Frequency (MHz) Order Number MSC8144E Flip Chip Plastic Ball Grid Array (FC-PBGA) Lead-free 1.0 V –40° to 105°C 800 TBD 0° to 90°C 1000 TBD Figure 45. MSC8144E Mechanical Information, 783-ball FC-PBGA Package Notes: 1. All dimensions in millimeters. 2. Dimensioning and tolerancing per ASME Y14.5M–1994. 3. Maximum solder ball diameter measured parallel to Datum A. 4. Datum A, the seating plane, is determined by the spherical crowns of the solder balls. 5. Parallelism measurement should exclude any effect of marking. 6. Capacitors may not be present on all devices. 7. Caution must be taken not to short exposed metal capacitor pads on package top. CASE NO. 1842-02 |
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