K32L2AX datasheet(49/96 Pages) NXP

49 / 96 page

2. VDD = 3.3 V, VREGIN= 5V, TA = 25 °C, fOSC = 8 MHz (crystal), fSYS_CORE = 96 MHz, fBUS = 24 MHz

3. IEC/SAE level maximum: L≤24dB mV

7.2.7 Designing with radiated emissions in mind

To find application notes that provide guidance on designing your system to minimize

interference from radiated emissions:

1. Go to www.nxp.com.

2. Perform a keyword search for “EMC design.”

7.2.8 Capacitance attributes

Table 19. Capacitance attributes

Symbol

Description

Min.

Max.

Unit

CIN

Input capacitance

—

7.3 Switching specifications

7.3.1 Device clock specifications

Table 20. Device clock specifications

Symbol

Description

Min.

Max.

Unit

Run mode1

Normal run mode

fSYS

System and core clock (DIVCORE_CLK)

—

MHz High speed run

mode

—

MHz Normal speed run

mode

—

MHz VLPR mode

fBUS

Bus clock/Slow clock (DIVSLOW_CLK)

—

MHz High speed run

mode and Normal

speed run mode

—

MHz VLPR mode

fFLASH

Flash clock

—

MHz High speed run

mode and Normal

speed run mode

—

MHz VLPR mode

fLLWU

LLWU clock

—

KHz

All modes

fRCM

RCM clock

—

KHz

All modes

Table continues on the next page...

General

K32 L2A Microcontroller with 512 KB Flash and 128 KB SRAM, Rev. 3, 02/2021

NXP Semiconductors

K32L2AX Datasheet(PDF) 49 Page - NXP Semiconductors

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