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K32L2AX Datasheet(PDF) 39 Page - NXP Semiconductors

No. de pieza K32L2AX
Descripción Electrónicos  K32 L2A Microcontroller with 512 KB Flash and 128 KB SRAM
PDF  96 Pages
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Fabricante Electrónico  NXP [NXP Semiconductors]
Página de inicio  http://www.nxp.com
Logo NXP - NXP Semiconductors

K32L2AX Datasheet(HTML) 39 Page - NXP Semiconductors

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Table 14. Voltage and current operating behaviors (continued)
Symbol
Description
Min.
Typ.
Max.
Unit
Notes
IIN
Input leakage current (total all pins) for full
temperature range
—
41
μA
2
IOZ
Hi-Z (off-state) leakage current (per pin)
—
1
μA
RPU
Internal pullup resistors
20
50
kΩ
3
1. PTB0, PTB1, PTC3, PTC4, PTD4, PTD5, PTD6 and PTD7 I/O have both high drive and normal drive capability
selected by the associated PORTx_PCRn[DSE] control bit. All other GPIOs are normal drive only. PTD4, PTD5,
PTD6, PTD7, PTE20, PTE21, PTE22, and PTE23 are also fast pins.
2. Measured at VDD = 3.6 V
3. Measured at VDD supply voltage = VDD min and Vinput = VSS
7.2.4 Power mode transition operating behaviors
All specifications in the following table assume this clock configuration in Run mode:
• CPU and system clocks = 48 MHz
• Bus and flash clock = 24 MHz
• SCG configured in FIRC mode; peripheral functional clocks from
FIRCDIV3_CLK and USB clock from FIRCDIV1_CLK
Table 15. Power mode transition operating behaviors
Symbol
Description
Min.
Typ.
Max.
Unit
Notes
tPOR
After a POR event, amount of time from the
point VDD reaches 1.8 V to execution of the first
instruction across the operating temperature
range of the chip.
—
—
300
μs
1
• VLLS0 → RUN
—
188
193
μs
• VLLS1 → RUN
—
188
193
μs
• VLLS2 → RUN
—
125
130
μs
• VLLS3 → RUN
—
125
130
μs
• LLS3 → RUN
—
5.5
6.1
μs
• LLS2 → RUN
—
5.5
6.1
μs
Table continues on the next page...
General
K32 L2A Microcontroller with 512 KB Flash and 128 KB SRAM, Rev. 3, 02/2021
39
NXP Semiconductors



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