TNETV2664FIBZWT datasheet(241/249 Pages) TI1

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TMS320C6424

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SPRS347D – MARCH 2007 – REVISED DECEMBER 2009

7.2

Thermal Data for ZDU

Table 7-2. Thermal Resistance Characteristics (PBGA Package) [ZDU]

NO.

°C/W(1)

AIR FLOW (m/s)(2)

ΘJC

Junction-to-case

7.7

N/A

ΘJB

Junction-to-board

10.5

N/A

19.7

0.00

ΘJA

Junction-to-free air

15.5

1.0

14.3

2.00

4.9

0.00

PsiJT

Junction-to-package top

5.1

1.0

5.2

2.00

10.4

0.00

PsiJB

Junction-to-board

9.8

1.0

9.6

2.00

(1)

The junction-to-case measurement was conducted in a JEDEC defined 1S0P system. Other measurements were conducted in a JEDEC

defined 1S2P system and will change based on environment as well as application.

For more information, see these three EIA/JEDEC standards:

•

EIA/JESD51-2, Integrated Circuits Thermal Test Method Environment Conditions - Natural Convection (Still Air)

•

EIA/JESD51-3, Low Effective Thermal Conductivity Test Board for Leaded Surface Mount Packages

•

JESD51-7, High Effective Thermal Conductivity Test Board for Leaded Surface Mount Packages

(2)

m/s = meters per second

7.3

Packaging Information

The following packaging information and addendum reflect the most current data available for the

designated device(s). This data is subject to change without notice and without revision of this document.

Mechanical Data

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