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STM32F334X4 Datasheet(PDF) 49 Page - STMicroelectronics |
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STM32F334X4 Datasheet(HTML) 49 Page - STMicroelectronics |
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49 / 115 page ![]() DocID025409 Rev 5 49/115 STM32F334x4 STM32F334x6 STM32F334x8 Electrical characteristics 100 6.3 Operating conditions 6.3.1 General operating conditions Table 19. General operating conditions Symbol Parameter Conditions Min. Max. Unit fHCLK Internal AHB clock frequency - 0 72 MHz fPCLK1 Internal APB1 clock frequency - 0 36 fPCLK2 Internal APB2 clock frequency - 0 72 VDD Standard operating voltage - 2 3.6 V VDD18 Core, SRAM and Flash memory power supply -1.65 1.95 VDDA Analog operating voltage (OPAMP and DAC not used) Must have a potential equal to or higher than VDD 23.6 Analog operating voltage (OPAMP and DAC used) 2.4 3.6 VBAT Backup operating voltage - 1.65 3.6 V VIN I/O input voltage TC I/O –0.3 VDD+0.3 V TT I/O -0.3 3.6 TTa I/O –0.3 VDDA+0.3 FT and FTf I/O(1) –0.3 5.5 BOOT0 0 5.5 PD Power dissipation at TA = 85 °C for suffix 6 or TA = 105 °C for suffix 7(2) LQFP64 - 444 mW PD Power dissipation at TA = 85 °C for suffix 6 or TA = 105 °C for suffix 7(2) LQFP48 - 364 mW PD Power dissipation at TA = 85 °C for suffix 6 or TA = 105 °C for suffix 7 LQFP32 - 333 mW TA Ambient temperature for 6 suffix version Maximum power dissipation –40 85 °C Low power dissipation(3) –40 105 Ambient temperature for 7 suffix version Maximum power dissipation –40 105 °C Low power dissipation(3) –40 125 TJ Junction temperature range 6 suffix version –40 105 °C 7 suffix version –40 125 1. To sustain a voltage higher than VDD+0.3 V, the internal pull-up/pull-down resistors must be disabled. 2. If TA is lower, higher PD values are allowed as long as TJ does not exceed TJmax (see Section Table 78.: Package thermal characteristics). 3. In low power dissipation state, TA can be extended to this range as long as TJ does not exceed TJmax (see Section 7.5: Thermal characteristics). |
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