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CC1150-RTR1 Datasheet(PDF) 10 Page - Texas Instruments

No. de pieza CC1150-RTR1
Descripción Electrónicos  Low Power Sub-1 GHz RF Transmitter
PDF  67 Pages
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Fabricante Electrónico  TI1 [Texas Instruments]
Página de inicio  http://www.ti.com
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CC1150-RTR1 Datasheet(HTML) 10 Page - Texas Instruments

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CC1150
SWRS037B – JANUARY 2006 – REVISED MARCH 2015
www.ti.com
4.11 Power-On Reset
For proper Power-On-Reset functionality, the power supply must comply with the requirements in this table. Otherwise, the
chip should be assumed to have unknown state until transmitting an SRES strobe over the SPI interface. See Section 5.11.1
for a description of the recommended start-up sequence after turning power on.
PARAMETER
MIN
TYP
MAX
UNIT
CONDITION
Power up ramp-up time
5
ms
From 0 V until reaching 1.8 V
Minimum time between power on and
Power-off time
1
ms
power off
4.12 Thermal Resistance Characteristics for VQFNP Package
NAME
DESCRIPTION
°C/W(1) (2)
RθJC(top)
Junction-to-case (top)
54.0
RθJB
Junction-to-board
25.1
RθJA
Junction-to-free air
48.3
PsiJT
Junction-to-package top
1.6
PsiJB
Junction-to-board
25.2
RθJC(bottom)
Junction-to-case (bottom)
6.3
(1)
°C/W = degrees Celsius per watt.
(2)
These values are based on a JEDEC-defined 2S2P system (with the exception of the Theta JC [RθJC] value, which is based on a
JEDEC-defined 1S0P system) and will change based on environment as well as application. For more information, see these
EIA/JEDEC standards:
JESD51-2, Integrated Circuits Thermal Test Method Environmental Conditions - Natural Convection (Still Air)
JESD51-3, Low Effective Thermal Conductivity Test Board for Leaded Surface Mount Packages
JESD51-7, High Effective Thermal Conductivity Test Board for Leaded Surface Mount Packages
JESD51-9, Test Boards for Area Array Surface Mount Package Thermal Measurements
Power dissipation of 2 W and an ambient temperature of 70ºC is assumed.
10
Specifications
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