Data Sheet S14265EJ2V0DS00

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7. RECOMMENDED SOLDERING CONDITIONS

The

µPD72850A should be soldered and mounted under the following recommended conditions.

For the details of the recommended soldering conditions, refer to the document Semiconductor Device Mounting

Technology Manual (C10535E).

For soldering methods and conditions other than those recommended below, contact your NEC sales

representative.

Table 7-1. Surface Mounting Type Soldering Conditions

µµµµPD72862GC-9EU : 100-pin plastic TQFP (Fine pitch) (14 x 14)

Soldering

Method

Soldering Conditions

Recommended

Condition Symbol

Infrared reflow

Package peak temperature: 235°C, Time: 30 sec. Max. (at 210°C or higher).

Count: three times or less

IR35-103-3

VPS

Package peak temperature: 215°C, Time: 40 sec. Max. (at 200°C or higher).

Count: three times or less

VP15-103-3

Partial heating

Pin temperature: 300°C Max., Time: 3 sec. Max. (per pin row)

—

Note After opening the dry pack, store it at 25°C or less and 65% RH or less for the allowable storage period.

Caution Do not use different soldering methods together (except for partial heating).

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