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ADG5433 Datasheet(PDF) 21 Page - Analog Devices |
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ADG5433 Datasheet(HTML) 21 Page - Analog Devices |
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21 / 24 page ![]() Data Sheet ADG5433/ADG5434 Rev. B | Page 21 of 24 OUTLINE DIMENSIONS 16 9 8 1 PIN 1 SEATING PLANE 8° 0° 4.50 4.40 4.30 6.40 BSC 5.10 5.00 4.90 0.65 BSC 0.15 0.05 1.20 MAX 0.20 0.09 0.75 0.60 0.45 0.30 0.19 COPLANARITY 0.10 COMPLIANT TO JEDEC STANDARDS MO-153-AB Figure 37. 16-Lead Thin Shrink Small Outline Package [TSSOP] (RU-16) Dimensions shown in millimeters 2.70 2.60 SQ 2.50 COMPLIANT TO JEDEC STANDARDS MO-220-WGGC. 1 0.65 BSC BOTTOM VIEW TOP VIEW 16 5 8 9 12 13 4 EXPOSED PAD PIN 1 INDICATOR 4.10 4.00 SQ 3.90 0.45 0.40 0.35 SEATING PLANE 0.80 0.75 0.70 0.05 MAX 0.02 NOM 0.20 REF 0.20 MIN COPLANARITY 0.08 PIN 1 INDICATOR 0.35 0.30 0.25 FOR PROPER CONNECTION OF THE EXPOSED PAD, REFER TO THE PIN CONFIGURATION AND FUNCTION DESCRIPTIONS SECTION OF THIS DATA SHEET. Figure 38. 16-Lead Lead Frame Chip Scale Package [LFCSP_WQ] 4 mm × 4 mm Body, Very Very Thin Quad (CP-16-17) Dimensions shown in millimeters |
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