6 Specifications

6.1 Absolute Maximum Ratings

Over free-air temperature range unless otherwise noted(1)

MIN

MAX

UNIT

Supply voltage (V+)

4

V

Voltage at SCL, ADD0, and SDA

–0.5

4

V

Voltage at ALERT

((V+) + 0.3)

and ≤ 4

V

Output current

±10

mA

Operating temperature

–55

150

°C

Junction temperature, TJ

150

°C

Storage temperature, Tstg

–60

150

°C

(1)

Operation outside the Absolute Maximum Ratings may cause permanent device damage. Absolute Maximum Ratings do not imply

functional operation of the device at these or any other conditions beyond those listed under Recommended Operating Conditions.

If used outside the Recommended Operating Conditions but within the Absolute Maximum Ratings, the device may not be fully

functional, and this may affect device reliability, functionality, performance, and shorten the device lifetime.

6.2 ESD Ratings

VALUE

UNIT

V(ESD)

Electrostatic discharge

Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1)

±2000

V

Charged-device model (CDM), per JEDEC specification JESD22-

C101(2)

±1000

(1)

JEDEC document JEP155 states that 500V HBM allows safe manufacturing with a standard ESD control process.

(2)

JEDEC document JEP157 states that 250- CDM allows safe manufacturing with a standard ESD control process.

6.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

MIN

NOM

MAX

UNIT

V+

Supply voltage

1.4

3.3

3.6

V

TA

Operating free-air temperature

–40

125

°C

6.4 Thermal Information

THERMAL METRIC(1)

TMP112A/B/D/N

TMP112Dx

UNIT

DRL (SOT563)

DPW (X2SON)

6 PINS

5 PINS

RθJA

Junction-to-ambient thermal resistance

240.2

230

°C/W

RθJC(top)

Junction-to-case (top) thermal resistance

96.4

194

°C/W

RθJB

Junction-to-board thermal resistance

124.3

158.4

°C/W

ψJT

Junction-to-top characterization parameter

4.0

20

°C/W

ψJB

Junction-to-board characterization parameter

123.1

158.3

°C/W

RθJC(bot)

Junction-to-case (bottom) thermal resistance

N/A

108.4

°C/W

MT

Thermal Mass

1.97

0.46

mJ/°C

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

note.

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TMP112, TMP112D

SBOS473L – MARCH 2009 – REVISED JULY 2024

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