9 Device and Documentation Support

9.1 Documentation Support

9.1.1 Related Documentation

For related documentation see the following:

• Texas Instruments, TMP102 Low-Power Digital Temperature Sensor With SMBus and Two-Wire Serial

Interface in SOT563, data sheet

• Texas Instruments, TMPx75 Temperature Sensor With I2C and SMBus Interface in Industry Standard LM75

Form Factor and Pinout, data sheet

• Texas Instruments, TMP275 ±0.5°C Temperature Sensor With I2C and SMBus Interface in Industry Standard

LM75 Form Factor and Pinout, data sheet

• Texas Instruments, Ultralow Power Multi-Sensor Data Logger With NFC Interface, design guide

• Texas Instruments, Capacitive-Based Human Proximity Detection for System Wake-Up & Interrupt, design

guide

• Texas Instruments, Designing and Manufacturing with TI's X2SON Packages, design guide

9.2 Receiving Notification of Documentation Updates

To receive notification of documentation updates, navigate to the device product folder on ti.com. Click on

Notifications to register and receive a weekly digest of any product information that has changed. For change

details, review the revision history included in any revised document.

9.3 Support Resources

TI E2E™ support forums are an engineer's go-to source for fast, verified answers and design help — straight

from the experts. Search existing answers or ask your own question to get the quick design help you need.

Linked content is provided "AS IS" by the respective contributors. They do not constitute TI specifications and do

not necessarily reflect TI's views; see TI's Terms of Use.

9.4 Trademarks

TI E2E™ is a trademark of Texas Instruments.

All trademarks are the property of their respective owners.

9.5 Electrostatic Discharge Caution

This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled

with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.

ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may

be more susceptible to damage because very small parametric changes could cause the device not to meet its published

specifications.

9.6 Glossary

TI Glossary

This glossary lists and explains terms, acronyms, and definitions.

10 Revision History

NOTE: Page numbers for previous revisions may differ from page numbers in the current version.

Changes from Revision K (June 2024) to Revision L (July 2024)

Page

• Updated the numbering format for tables, figures, and cross-references throughout the document................. 1

• Updated the typo for Average quiescent current “Serial bus active, SCL frequency = 2.85 MHz” typical value

from 30µA to 40µA............................................................................................................................................. 6

• Updated the typo for Shutdown current “Serial bus active, SCL frequency = 2.85 MHz” typical value from

25µA to 35µA......................................................................................................................................................6

• Updated empty graphs in the Typical Characteristics section.......................................................................... 10

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TMP112, TMP112D

SBOS473L – MARCH 2009 – REVISED JULY 2024

Copyright © 2024 Texas Instruments Incorporated

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Product Folder Links: TMP112 TMP112D