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TMP112DX Datasheet(PDF) 37 Page - Texas Instruments |
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TMP112DX Datasheet(HTML) 37 Page - Texas Instruments |
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37 / 46 page ![]() www.ti.com EXAMPLE BOARD LAYOUT 0.05 MIN ALL AROUND TYP (0.21) TYP EXPOSED METAL CLEARANCE (R0.05) TYP 4X (0.42) 4X (0.22) 4X (0.26) ( 0.25) ( 0.1) VIA (0.78) (0.48) 4X (0.06) X2SON - 0.4 mm max height DPW0005B PLASTIC SMALL OUTLINE - NO LEAD 4228233/D 09/2023 SYMM 1 2 3 4 SYMM LAND PATTERN EXAMPLE SOLDER MASK DEFINED SCALE:60X 5 SOLDER MASK OPENING, TYP METAL UNDER SOLDER MASK, TYP NOTES: (continued) 4. This package is designed to be soldered to a thermal pad on the board. For more information, refer to QFN/SON PCB application note in literature No. SLUA271 (www.ti.com/lit/slua271). www.ti.com TMP112, TMP112D SBOS473L – MARCH 2009 – REVISED JULY 2024 Copyright © 2024 Texas Instruments Incorporated Submit Document Feedback 37 Product Folder Links: TMP112 TMP112D |
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