LTC6078/LTC6079

17

60789fa

PACKAGE DESCRIPTIO

3.00

±0.10

(2 SIDES)

5.00

±0.10

(2 SIDES)

NOTE:

1. DRAWING PROPOSED TO BE MADE VARIATION OF VERSION (WJED-1) IN JEDEC

PACKAGE OUTLINE MO-229

2. DRAWING NOT TO SCALE

3. ALL DIMENSIONS ARE IN MILLIMETERS

4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE

MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE

5. EXPOSED PAD SHALL BE SOLDER PLATED

6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION ON THE

TOP AND BOTTOM OF PACKAGE

0.40

± 0.10

BOTTOM VIEW—EXPOSED PAD

1.65

± 0.10

(2 SIDES)

0.75

±0.05

R = 0.115

TYP

R = 0.20

TYP

4.40

±0.10

(2 SIDES)

1

8

16

9

PIN 1

TOP MARK

(SEE NOTE 6)

0.200 REF

0.00 – 0.05

(DHC16) DFN 1103

0.25

± 0.05

PIN 1

NOTCH

0.50 BSC

4.40

±0.05

(2 SIDES)

RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS

1.65

±0.05

(2 SIDES)

2.20

±0.05

0.50 BSC

0.65

±0.05

3.50

±0.05

PACKAGE

OUTLINE

0.25

± 0.05

DHC Package

16-Lead Plastic DFN (5mm × 3mm)

(Reference LTC DWG # 05-08-1706)