ICSSSTUAF32868B

28-BIT CONFIGURABLE REGISTERED BUFFER FOR DDR2

COMMERCIAL TEMPERATURE GRADE

28-BIT CONFIGURABLE REGISTERED BUFFER FOR DDR2

20

ICSSSTUAF32868B

7102/2

Package Outline and Package Dimensions - BGA

Package dimensions are kept current with JEDEC Publication No. 95

SEATING

PLANE

0.12

C

C

A

B

C

D

A1

D

E

TOP VIEW

T

hTYP

dTYP

43

2

1

Numeric Designations

for Horizontal Grid

bREF

cREF

TYP

-e-

TYP

-e-

D1

E1

Alpha Designations

for Vertical Grid

(Letters I, O, Q, and

S not used)

ALL DIMENSIONS IN MILLIMETERS

D

15.00 Bsc

E

6.00 Bsc

T

Min/Max

0.94/1.20

e

0.65 Bsc

d

Min/Max

0.35/0.45

h

Min/Max

0.25/0.35

D1

13.65 Bsc

E1

4.55 Bsc

b

0.675

c

0.725

BALL GRID

REF. DIMS

NOTE: Ball grid total indicates maximum ball count for package. Lesser quantity may be used.

* Source Ref.: JEDEC Publication 95, MO-205*, MO-255**, MO-246***

10-0055

Horiz

8

Vert

22

Total

176

***