ADP5056ACCZ-R7 datasheet(7/31 Pages) AD

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Data Sheet

ADP5056

Rev. 0 | Page 7 of 31

ABSOLUTE MAXIMUM RATINGS

Table 3.

Parameter

Rating

VBIAS to GND

−0.3 V to +21 V

PVINx to PGND

−0.3 V to +21 V

SWx to PGND

−0.3 V to +21 V

RAMPx to GND

−0.3 V to +21 V

PGND to GND

−0.3 V to +0.3 V

BST1 to SW1

−0.3 V to +6.5 V

BST2 to SW2

−0.3 V to +6.5 V

BST3 to SW3

−0.3 V to +6.5 V

CFG1 and CFG2 to GND

−0.3 V to +6.5 V

ENx to GND

−0.3 V to +21 V

VREG to GND

−0.3 V to +6.5 V

SYNC/MODE to GND

−0.3 V to +6.5 V

RT to GND

−0.3 V to +6.5 V

PWRGD to GND

−0.3 V to +6.5 V

FB1, FB2, and FB3 to GND

−0.3 V to +6.5 V

COMPx to GND

−0.3 V to +6.5 V

Storage Temperature Range

−65°C to +150°C

Operational Junction Temperature

Range

−40°C to +150°C

Stresses at or above those listed under Absolute Maximum

Ratings may cause permanent damage to the product. This is a

stress rating only; functional operation of the product at these

or any other conditions above those indicated in the operational

section of this specification is not implied. Operation beyond

the maximum operating conditions for extended periods may

affect product reliability.

THERMAL RESISTANCE

Thermal performance is directly linked to printed circuit board

(PCB) design and operating environment. Careful attention to

PCB thermal design is required.

Thermal resistance values specified in Table 4 are simulated based

on JEDEC specs (unless specified otherwise) and are used in

compliance with JESD51-12. Using enhanced heat removal (PCB,

heat sink, airflow) technique improves thermal resistance values.

Table 4. Thermal Resistance

Package Type

θJA

θJC1

θJB

ΨJT

ΨJB

Unit

CC-43-1

26.0

14.3

9.3

0.2

9.0

(°C/W)

For θJC test, 100 µm thermal interface material (TIM) is used. TIM is assumed

to have 3.6 W/mK.

ESD CAUTION

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