TUSB8043RGCT datasheet(9/59 Pages) TI1

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TUSB8043

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SLLSEW4 – JUNE 2017

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(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended

Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

7 Specifications

7.1 Absolute Maximum Ratings

(1)

over operating free-air temperature range (unless otherwise noted)

MIN

MAX

UNIT

Supply Voltage Range

VDD Steady-state supply voltage

–0.3

1.4

VDD33 Steady-state supply voltage

–0.3

3.8

Voltage Range

USB_SSRXP_UP, USB_SSRXN_UP, USB_SSRXP_DN[4:1],

USB_SSRXN_DP[4:1] and USB_VBUS terminals

-0.3

1.4

XI terminals

-0.3

2.45

All other terminals

-0.3

3.8

Storage temperature, Tstg

–65

150

°C

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2)

JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

7.2 ESD Ratings

VALUE

UNIT

V(ESD)

Electrostatic discharge

Human body model (HBM), per ANSI/ESDA/JEDEC JS-001(1)

±2000

Charged device model (CDM), per JEDEC specification JESD22-

C101(2)

±500

(1)

A 1.05-V, 1.1-V, or 1.2-V supply may be used as long as minimum and maximum supply conditions are met.

7.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

MIN

NOM

MAX

UNIT

VDD(1)

1.1V supply voltage

0.99

1.1

1.26

VDD33

3.3V supply voltage

3.3

3.6

USB_VBUS

Voltage at USB_VBUS PAD

1.155

Operating free-air temperature

TUSB8043

°C

Operating junction temperature

–40

105

°C

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report.

7.4 Thermal Information

THERMAL METRIC(1)

TUSB8043

UNIT

RGC

64 PINS

RθJA

Junction-to-ambient thermal resistance

°C/W

RθJCtop

Junction-to-case (top) thermal resistance

11.5

°C/W

RθJB

Junction-to-board thermal resistance

5.3

°C/W

ψJT

Junction-to-top characterization parameter

0.2

°C/W

ψJB

Junction-to-board characterization parameter

5.2

°C/W

RθJCbot

Junction-to-case (bottom) thermal resistance

1.0

°C/W

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