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Motor de Búsqueda de Datasheet de Componentes Electrónicos |
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Motor de Búsqueda de Datasheet de Componentes Electrónicos |
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TUSB8043RGCT Datasheet(PDF) 52 Page - Texas Instruments |
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TUSB8043RGCT Datasheet(HTML) 52 Page - Texas Instruments |
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52 / 59 page  www.ti.com PACKAGE OUTLINE C SEE DETAIL 64X 0.30 0.18 6 0.05 64X 0.5 0.3 1 MAX (0.2) TYP 0.05 0.00 60X 0.5 2X 7.5 2X 7.5 A 9.1 8.9 B 9.1 8.9 (0.1) TYP VQFN - 1 mm max height RGC0064G PLASTIC QUAD FLATPACK - NO LEAD 4222053/B 06/2015 PIN 1 INDEX AREA 0.08 SEATING PLANE 1 16 33 48 17 32 64 49 (OPTIONAL) PIN 1 ID 0.1 C A B 0.05 EXPOSED THERMAL PAD NOTES: 1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing per ASME Y14.5M. 2. This drawing is subject to change without notice. 3. The package thermal pad must be soldered to the printed circuit board for thermal and mechanical performance. SCALE 1.500 SCALE 8.000 LEADFRAME PROFILE OPTION 52 TUSB8043 SLLSEW4 – JUNE 2017 www.ti.com Product Folder Links: TUSB8043 Submit Documentation Feedback Copyright © 2017, Texas Instruments Incorporated |
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