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STM32F078CB Datasheet(PDF) 114 Page - STMicroelectronics |
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STM32F078CB Datasheet(HTML) 114 Page - STMicroelectronics |
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114 / 120 page  Package information STM32F078CB, STM32F078RB, STM32F078VB 114/120 DocID026006 Rev 4 7.7 Thermal characteristics The maximum chip junction temperature (TJmax) must never exceed the values given in Table 23: General operating conditions . The maximum chip-junction temperature, TJ max, in degrees Celsius, may be calculated using the following equation: TJ max = TA max + (PD max x ΘJA) Where: • TA max is the maximum ambient temperature in °C, • ΘJA is the package junction-to-ambient thermal resistance, in °C/W, • PD max is the sum of PINT max and PI/O max (PD max = PINT max + PI/Omax), • PINT max is the product of IDD and VDD, expressed in Watts. This is the maximum chip internal power. PI/O max represents the maximum power dissipation on output pins where: PI/O max = Σ (VOL × IOL) + Σ ((VDDIOx – VOH) × IOH), taking into account the actual VOL / IOL and VOH / IOH of the I/Os at low and high level in the application. 7.7.1 Reference document JESD51-2 Integrated Circuits Thermal Test Method Environment Conditions - Natural Convection (Still Air). Available from www.jedec.org 7.7.2 Selecting the product temperature range When ordering the microcontroller, the temperature range is specified in the ordering information scheme shown in Section 8: Ordering information. Each temperature range suffix corresponds to a specific guaranteed ambient temperature at maximum dissipation and, to a specific maximum junction temperature. Table 76. Package thermal characteristics Symbol Parameter Value Unit ΘJA Thermal resistance junction-ambient UFBGA100 - 7 × 7 mm 55 °C/W Thermal resistance junction-ambient LQFP100 - 14 × 14 mm 42 Thermal resistance junction-ambient LQFP64 - 10 × 10 mm / 0.5 mm pitch 44 Thermal resistance junction-ambient LQFP48 - 7 × 7 mm 54 Thermal resistance junction-ambient UFQFPN48 - 7 × 7 mm 32 Thermal resistance junction-ambient WLCSP49 - 0.4 mm pitch 49 |
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