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STM32F078CB Datasheet(PDF) 111 Page - STMicroelectronics |
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STM32F078CB Datasheet(HTML) 111 Page - STMicroelectronics |
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111 / 120 page ![]() DocID026006 Rev 4 111/120 STM32F078CB, STM32F078RB, STM32F078VB Package information 117 7.6 UFQFPN48 package information UFQFPN48 is a 48-lead, 7x7 mm, 0.5 mm pitch, ultra-thin fine-pitch quad flat package. Figure 48. UFQFPN48 package outline 1. Drawing is not to scale. 2. All leads/pads should also be soldered to the PCB to improve the lead/pad solder joint life. 3. There is an exposed die pad on the underside of the UFQFPN package. It is recommended to connect and solder this back-side pad to PCB ground. |
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