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MPC8248VRP Datasheet(PDF) 11 Page - Motorola, Inc

No. de pieza MPC8248VRP
Descripción Electrónicos  MPC8272 PowerQUICC II Family Hardware Specifications
PDF  56 Pages
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Fabricante Electrónico  MOTOROLA [Motorola, Inc]
Página de inicio  http://www.freescale.com
Logo MOTOROLA - Motorola, Inc

MPC8248VRP Datasheet(HTML) 11 Page - Motorola, Inc

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MOTOROLA
MPC8272 PowerQUICC II™ Family Hardware Specifications
11
PRELIMINARY—SUBJECT TO CHANGE WITHOUT NOTICE
Thermal Characteristics
4
Thermal Characteristics
Table 6 describes thermal characteristics. Refer to Table 2 for information on a given device’s package.
Discussions of each characteristic are provided in sections 4.1 through 4.7. For the these discussions, PD =
(VDD × IDD) + PI/O, where PI/O is the power dissipation of the I/O drivers.
4.1
Estimation with Junction-to-Ambient Thermal
Resistance
An estimation of the chip junction temperature, TJ, in °C can be obtained from the equation:
TJ = TA + (RθJA × PD)
where:
TA = ambient temperature (ºC)
RθJA = package junction-to-ambient thermal resistance (ºC/W)
PD = power dissipation in package
The junction-to-ambient thermal resistance is an industry standard value which provides a quick and easy
estimation of thermal performance. However, the answer is only an estimate; test cases have demonstrated
that errors of a factor of two (in the quantity TJ – TA) are possible.
Table 6. Thermal Characteristics
Characteristic
Symbol
Value
Unit
Air Flow
Junction-to-ambient—
single-layer board 1
1 Assumes no thermal vias
RθJA
27
°C/W
Natural convection
21
1 m/s
Junction-to-ambient—
four-layer board
RθJA
19
°C/W
Natural convection
16
1 m/s
Junction-to-board 2
2 Thermal resistance between the die and the printed circuit board per JEDEC JESD51-8. Board temperature is
measured on the top surface of the board near the package.
RθJB
11
°C/W
Junction-to-case 3
3 Thermal resistance between the die and the case top surface as measured by the cold plate method (MIL SPEC-883
Method 1012.1).
RθJC
8
°C/W
Junction-to-package top 4
4 Thermal characterization parameter indicating the temperature difference between package top and the junction
temperature per JEDEC JESD51-2. When Greek letters are not available, the thermal characterization parameter is
written as Psi-JT.
RθJT
2
°C/W
Freescale Semiconductor, Inc.
For More Information On This Product,
Go to: www.freescale.com



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