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AN3169 Datasheet(PDF) 2 Page - STMicroelectronics

No. de pieza AN3169
Descripción Electrónicos  Technology performance comparison of Triacs subjected to fast transient voltages
PDF  12 Pages
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Fabricante Electrónico  STMICROELECTRONICS [STMicroelectronics]
Página de inicio  http://www.st.com
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AN3169 Datasheet(HTML) 2 Page - STMicroelectronics

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Triac technologies and immunity
AN3169
2/12
Doc ID 17194 Rev 1
1
Triac technologies and immunity
1.1
Triac silicon structures
Triac devices are by far the most used silicon devices to drive AC loads directly connected
on the mains voltage. Triacs are widely used because they present three major advantages:
Low forward voltage drop
Turn on by gate current pulse
High voltage immunity
The first two advantages come from the active silicon structure of the Triac which is based
on four alternatively doped silicon layers (N-P-N-P). These four layers implement two bipolar
transistors which are coupled to maintain the on state even if the gate current is removed
(see Figure 1).
Figure 1.
Active simplified structure of a Triac
The third advantage comes from the fact that the voltage is withstood by the silicon
thickness. It's then quite easy to reach breakdown levels above 1 kV. The main issue is then
the junction termination. Several low cost technologies are used since the 70’s which used a
glass passivation. For example the “Mesa” technology (see Figure 2) uses glass on both
sides of the die (see References 1, 2, and 3) to passivate both junctions, which hold both
forward and reverse high voltages (referred to as “Cathode” or “A1” or “COM” polarity). The
“Top” glass technology (see References 1, 2, and 3) uses only one glass layer (see
Figure 3). This avoids having some glass at the bottom of the die, and so it is easier to put
such dies in every kind of package.
Figure 2.
“Mesa” glass technology
N3
P2
N2
P1
N1
P2
N2
P1
N4
A2
A1
G
N3
P2
N2
P1
N1
P2
N2
P1
N4
Metalization
N
N
N
P
P
N
N
Anode
Glass
Cathode
Gate



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