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AS1123

Datasheet - A b s o l u t e M a x i m u m R a t i n g s

5 Absolute Maximum Ratings

Stresses beyond those listed in Table 2 may cause permanent damage to the device. These are stress ratings only, and functional operation of

the device at these or any other conditions beyond those indicated in Section 6 Electrical Characteristics on page 4 is not implied. Exposure to

absolute maximum rating conditions for extended periods may affect device reliability.

Table 2. Absolute Maximum Ratings

Parameter

Min

Max

Units

Comments

Electrical Parameters

VDD to GND

0

7

V

Input Voltage

-0.4

V

Output Voltage

-0.4

7

V

GND Pin Current

2000

mA

24-pin QSOP package

2800

mA

24-pin TQFN (4x4mm) package

Input Current (latch-up immunity)

-100

+100

mA

Norm: JEDEC 78

Electrostatic Discharge

Electrostatic Discharge HBM

+/- 1

kV

Norm: MIL 883 E method 3015

Temperature Ranges and Storage Conditions

Thermal Resistance

88

ºC/W

on PCB, 24-pin QSOP package

23

ºC/W

on PCB, 24-pin TQFN (4x4mm) package

Junction Temperature

150

°C

Storage Temperature

-55

150

ºC

Package Body Temperature

+260

ºC

The reflow peak soldering temperature (body temperature)

specified is in accordance with IPC/JEDEC J-STD-020

“Moisture/Reflow Sensitivity Classification for Non-

Hermetic Solid State Surface Mount Devices”.

The lead finish for Pb-free leaded packages is matte tin

(100% Sn).

Humidity

5

85

%

Non-condensing

Moisture Sensitive Level

3

Represents a max. floor life time of 168h