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W25Q32FVZPIP Datasheet(PDF) 95 Page - Winbond |
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W25Q32FVZPIP Datasheet(HTML) 95 Page - Winbond |
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95 / 99 page ![]() W25Q32FV Publication Release Date: Sept 16,, 2013 - 94 - Revision H 10.8 24-Ball TFBGA 8x6-mm (Package Code TC, 6x4 ball array) Symbol Millimeters Inches Min Nom Max Min Nom Max A --- --- 1.20 --- --- 0.047 A1 0.25 0.30 0.35 0.010 0.012 0.014 b 0.35 0.40 0.45 0.014 0.016 0.018 D 7.95 8.00 8.05 0.313 0.315 0.317 D1 5.00 BSC 0.197 BSC E 5.95 6.00 6.05 0.234 0.236 0.238 E1 3.00 BSC 0.118 BSC e 1.00 BSC 0.039 BSC Note: Ball land: 0.45mm. Ball Opening: 0.35mm PCB ball land suggested <= 0.35mm |
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