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STM32F101X6 Datasheet(PDF) 31 Page - STMicroelectronics

No. de pieza STM32F101X6
Descripción Electrónicos  Low-density access line, ARM-based 32-bit MCU with 16 or 32 KB Flash, 5 timers, ADC and 4 communication interfaces
PDF  79 Pages
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Fabricante Electrónico  STMICROELECTRONICS [STMicroelectronics]
Página de inicio  http://www.st.com
Logo STMICROELECTRONICS - STMicroelectronics

STM32F101X6 Datasheet(HTML) 31 Page - STMicroelectronics

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STM32F101x4, STM32F101x6
Electrical characteristics
Doc ID 15058 Rev 5
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5.3.2
Operating conditions at power-up / power-down
Subject to general operating conditions for TA.
Table 9.
Operating conditions at power-up / power-down
5.3.3
Embedded reset and power control block characteristics
The parameters given in Table 10 are derived from tests performed under the ambient
temperature and VDD supply voltage conditions summarized in Table 8.
PD
Power dissipation at TA =
85 °C(3)
LQFP64
444
mW
LQFP48
363
VFQFPN36
1000
TA
Ambient temperature
Maximum power dissipation
–40
85
°C
Low power dissipation(4)
–40
105
°C
TJ
Junction temperature range
–40
105
°C
1.
When the ADC is used, refer to Table 42: ADC characteristics.
2.
It is recommended to power VDD and VDDA from the same source. A maximum difference of 300 mV
between VDD and VDDA can be tolerated during power-up and operation.
3.
If TA is lower, higher PD values are allowed as long as TJ does not exceed TJmax (see Table 6.2: Thermal
characteristics on page 74).
4.
In low power dissipation state, TA can be extended to this range as long as TJ does not exceed TJmax (see
Table 6.2: Thermal characteristics on page 74).
Table 8.
General operating conditions (continued)
Symbol
Parameter
Conditions
Min
Max
Unit
Symbol
Parameter
Conditions
Min
Max
Unit
tVDD
VDD rise time rate
0
∞
µs/V
VDD fall time rate
20
∞



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