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MCP87018 Datasheet(PDF) 1 Page - Microchip Technology |
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MCP87018 Datasheet(HTML) 1 Page - Microchip Technology |
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1 / 14 page ![]() 2013 Microchip Technology Inc. DS22329A-page 1 MCP87018 Features: • Low Drain-to-Source On Resistance (RDS(ON)) • Low Total Gate Charge (QG) and Gate-to-Drain Charge (QGD) • Low Series Gate Resistance (RG) •Fast Switching • Capable of Short Dead-Time Operation • RoHS Compliant Applications: • Point-of-Load DC-DC Converters • High Efficiency Power Management in Servers, Networking and Automotive Applications Description: The MCP87018 is an N-Channel power MOSFET in a popular PDFN 5 mm x 6 mm package. Advanced packaging and silicon processing technologies allow the MCP87018 to achieve a low QG for a given RDS(on) value, resulting in a low Figure of Merit (FOM). Combined with low RG, the low FOM of the MCP87018 allows high efficiency power conversion with reduced switching and conduction losses. Package Type Product Summary Table: Unless otherwise indicated, TA = +25°C Parameters Sym. Min. Typ. Max. Units Conditions Operating Characteristics Drain-to-Source Breakdown Voltage BVDSS 25 — — V VGS = 0V, ID = 250 µA Gate-to-Source Threshold Voltage VGS(TH) 11.3 1.6 V VDS = VGS, ID = 250 µA Drain-to-Source On Resistance RDS(ON) —1.8 2.2 mΩ VGS = 4.5V, ID = 25A —1.5 1.9 mΩ VGS = 10V, ID = 25A Total Gate Charge QG — 32.5 37 nC VDS = 12.5V, ID = 25A, VGS = 4.5V Gate-to-Drain Charge QGD —13— nC VDS = 12.5V, ID = 25A Series Gate Resistance RG —1.5 — Ω — Thermal Characteristics Thermal Resistance Junction-to-X RθJX —— 56 °C/W Note 1 Thermal Resistance Junction-to-Case RθJC —— 1.4 °C/W Note 2 Note 1: RθJX is determined with the device surface mounted on a 4-Layer FR4 PCB, with a 1" x 1" mounting pad of 2 oz. copper. This characteristic is dependent on user’s board design. 2: RθJC is determined using JEDEC 51-14 Method. This characteristic is determined by design. S G S S D D D D 1 2 3 4 5 6 7 8 PDFN 5 x 6 High-Speed N-Channel Power MOSFET |
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