◎ SEMIHOW REV.A0,Dec 2005

2

1

3

BV

R

I

 Originative New Design

 Superior Avalanche Rugged Technology

 Robust Gate Oxide Technology

 Very Low Intrinsic Capacitances

 Excellent Switching Characteristics

 Unrivalled Gate Charge : 35 nC (Typ.)

 Extended Safe Operating Area

 Lower R

 100% Avalanche Tested

Thermal Resistance Characteristics

FEATURES

Absolute Maximum Ratings

T

HFS6N90

900V N-Channel MOSFET

Symbol

Parameter

Value

Units

V

DSS

Drain-Source Voltage

900

V

I

D

Drain Current

– Continuous (T

6.0*

A

Drain Current

– Continuous (T

3.8*

A

I

DM

Drain Current

– Pulsed

(Note 1)

24*

A

V

GS

Gate-Source Voltage

±30

V

E

AS

Single Pulsed Avalanche Energy

(Note 2)

650

mJ

I

AR

Avalanche Current

(Note 1)

6.0

A

E

AR

Repetitive Avalanche Energy

(Note 1)

16.7

mJ

dv/dt

Peak Diode Recovery dv/dt

(Note 3)

4.5

V/ns

P

D

Power Dissipation (T

- Derate above 25℃

56

W

0.48

W/℃

T

Operating and Storage Temperature Range

-55 to +150

℃

T

L

Maximum lead temperature for soldering purposes,

1/8” from case for 5 seconds

300

℃

Symbol

Parameter

Typ.

Max.

Units

Junction-to-Case

--

2.25

℃/W

Junction-to-Ambient

--

62.5

Dec 2005

* Drain current limited by maximum junction temperature

TO-220F

1.Gate 2. Drain 3. Source