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AS1109 Datasheet(PDF) 22 Page - ams AG |
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AS1109 Datasheet(HTML) 22 Page - ams AG |
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22 / 26 page ![]() www.austriamicrosystems.com Revision 1.18 22 - 26 AS1109 Data Sheet - P a c k age Drawin gs an d Ma rkings Figure 26. 16-pin SSOP-150 Package Symbol Min Max A1.35 1.75 A1 0.10 0.25 A2 1.37 1.57 b0.20 0.30 C0.19 0.25 D4.80 4.98 E5.79 6.20 E1 3.81 3.99 e 0.635 BSC h0.22 0.49 L0.40 1.27 θ 0º 8º ZD 0.230 REF N 16 pins Notes: 1. Lead coplanarity should be 0 to 0.10mm (.004”) max. 2. Package surfacing: a. Top: matte (charmilles #18- 30). b. All sides: matte (charmilles #18- 30). c. Bottom: smooth or matte (charmilles #18- 30). 3. All dimensions excluding mold flashes and end flash from the package body shall not exceed 0.25mm (.010”) per side (D). 4. Dimensions “b” does not include dambar protrusion/intrusion but solder coverage. 5. Dimensions are in millimeters. |
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