MPC5634MF0MMGA8 datasheet(61/118 Pages) FREESCALE

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Electrical characteristics

MPC5634M Microcontroller Data Sheet, Rev. 4

Preliminary—Subject to Change Without Notice

Freescale Semiconductor

3.3.1

General notes for specifications at maximum junction temperature

An estimation of the chip junction temperature, TJ, can be obtained from the equation:

TJ = TA + (RθJA * PD)

Eqn. 1

where:

TA = ambient temperature for the package (oC)

RθJA = junction-to-ambient thermal resistance (oC/W)

PD = power dissipation in the package (W)

The thermal resistance values used are based on the JEDEC JESD51 series of standards to provide consistent values for

estimations and comparisons. The difference between the values determined for the single-layer (1s) board compared to a

four-layer board that has two signal layers, a power and a ground plane (2s2p), demonstrate that the effective thermal resistance

is not a constant. The thermal resistance depends on the:

•

Construction of the application board (number of planes)

Table 11. Thermal characteristics for 208-pin MAPBGA1

1 Thermal characteristics are targets based on simulation that are subject to change per device characterization.

Symbol

Parameter

Conditions

Value

Unit

RθJA

Junction-to-ambient, natural convection2,3

2 Junction temperature is a function of die size, on-chip power dissipation, package thermal resistance, mounting site

(board) temperature, ambient temperature, air flow, power dissipation of other components on the board, and board

thermal resistance.

3 Per SEMI G38-87 and JEDEC JESD51-2 with the single-layer board horizontal.

One layer board - 1s

°C/W

RθJMA

Junction-to-ambient natural convection2,4

4 Per JEDEC JESD51-6 with the board horizontal.

Four layer board - 2s2p

°C/W

RθJA

Junction-to-ambient2,4

Single layer board

°C/W

RθJMA

Junction-to-ambient2,4

Four layer board 2s2p

°C/W

RθJB

Junction-to-board5

Thermal resistance between the die and the printed circuit board per JEDEC JESD51-8. Board temperature is

measured on the top surface of the board near the package.

Four layer board - 2s2p

°C/W

RθJC

Junction-to-case6

6 Indicates the average thermal resistance between the die and the case top surface as measured by the cold plate

method (MIL SPEC-883 Method 1012.1) with the cold plate temperature used for the case temperature.

°C/W

Junction-to-package top natural

convection7

7 Thermal characterization parameter indicating the temperature difference between package top and the junction

temperature per JEDEC JESD51-2. When Greek letters are not available, the thermal characterization parameter

is written as Psi-JT.

°C/W

MPC5634MF0MMGA8 Datasheet(PDF) 61 Page - Freescale Semiconductor, Inc

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