ADIS16505-2SLASHPCBZ datasheet(7/41 Pages) AD

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Data Sheet

ADIS16505

Rev. C | Page 7 of 41

ABSOLUTE MAXIMUM RATINGS

Table 3.

Parameter

Rating

Mechanical Shock Survivability

Any Axis, Unpowered, 0.5 ms ,

½ Sine.

14,700 m/sec2

VDD to GND

−0.3 V to +3.6 V

Digital Input Voltage to GND

−0.3 V to VDD + 0.2 V

Digital Output Voltage to GND

−0.3 V to VDD + 0.2 V

Temperature Range

Calibration

−40°C to +85°C

Operating

−40°C to +105°C

Storage1

−65°C to +150°C

Barometric Pressure

2 bar

1 Extended exposure to temperatures that are lower than −40°C or higher

than +105°C can adversely affect the accuracy of the factory calibration.

Stresses at or above those listed under Absolute Maximum

Ratings may cause permanent damage to the product. This is a

stress rating only; functional operation of the product at these

or any other conditions above those indicated in the operational

section of this specification is not implied. Operation beyond

the maximum operating conditions for extended periods may

affect product reliability.

THERMAL RESISTANCE

Thermal performance is directly linked to printed circuit board

(PCB) design and operating environment. Careful attention to

PCB thermal design is required.

The ADIS16505 is a multichip module that includes many

active components. The values in Table 4 identify the thermal

response of the hottest component inside of the ADIS16505,

with respect to the overall power dissipation of the module.

This approach enables a simple method for predicting the

temperature of the hottest junction, based on either ambient

or case temperature.

For example, when the ambient temperature is 70°C, the hottest

junction temperature (TJ) inside of the ADIS16505 is 76.7°C.

TJ = θJA × VDD × IDD + 70°C

TJ = 107.1°C/W × 3.3 V × 0.044 A + 70°C

TJ = 85.6°C

Table 4. Package Characteristics

Package Type

θJA1

θJC2

Device Weight

ML-100-13

107.1°C/W

74.7°C/W

<1.75 g

1 θJA is the natural convection junction to ambient thermal resistance

measured in a one cubic foot sealed enclosure.

2 θJC is the junction to case thermal resistance.

3 Thermal impedance values come from direct observation of the hottest

temperature inside of the ADIS16505 when it is attached to an FR4-08 PCB

that has two metal layers and has a thickness of 0.063 inches.

ESD CAUTION

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