LAN8808DSLASHKDX datasheet(59/80 Pages) MICROCHIP

59 / 80 page

LAN8808D

DS00005833C-page 59

6.4

Package Thermal Specifications

4 ports + QSGMII, 1000BASE-T Master,

EEE Sleep state

226

212

0.1

802

4 ports + QSGMII, 1000BASE-T Slave,

EEE Sleep state

226

212

0.1

802

4 ports + QSGMII, 100BASE-TX,

EEE Sleep state

148

181

0.4

631

4 ports + QSGMII,

Energy Detect Power Down mode, QSGMII up

199

0.1

617

4 ports + QSGMII,

Software Power Down mode, QSGMII up

0.1

174

4 ports + QSGMII,

Software Power Down mode, QSGMII down

0.1

4 ports + QSGMII,

hardware reset

212

0.1

548

TABLE 6-4:

PACKAGE THERMAL PARAMETERS

Parameter

Symbol

Value

Unit

Description

Thermal Resistance Junction to Ambient

JA

17.06

°C/W

Measured in still air

13.14

°C/W

Airflow 1 m/s

12.01

°C/W

Airflow 2 m/s

Thermal Resistance Junction to Bottom of Case

JT

0.21

°C/W

Measured in still air

Thermal Resistance Junction to Top of Case

JC

7.11

°C/W

—

Thermal Resistance Junction to Board

JB

5.74

°C/W

Note:

Thermal parameters are measured or estimated for devices in a multi-layer 2S2P PCB per JESD51.

TABLE 6-3:

TYPICAL FOUR PORT (1.21V, 2.5V, 1.8V) POWER CONSUMPTION (CONTINUED)

Device Conditions

1.21V

Total (mA)

(Note 6-3)

2.5V VDDAH

Total (mA)

(Note 6-4)

1.8V VDDIO

Total (mA)

(Note 6-5)

Total

Device

Power

(mW)

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