8 Specifications

8.1 Absolute Maximum Ratings

MIN

MAX(1)

UNIT(2)

VDD

Supply Voltage

16

IDD

Supply Current

Quiescent

20

mA

Switching, TA = 25°C, TJ = 125°C, VDD = 12 V

200

VOUT

Output Gate

Drive Voltage

OUT

–1 V

VDD

V

IOUT(sink)

Output Gate

Drive Current

OUT

4.0

A

IOUT(source)

–4.0

Analog Input

ISET, CS

–0.3

3.6

V

ILIM

–0.3

3.6

Digital I/O’s

IN, CLF

–0.3

3.6

Power

Dissipation

TA = 25°C, TJ = 125°C, (PWP-14)

2.67

W

TJ

Junction Operating Temperature

-–55

150

°C

TSOL

Lead Temperature (Soldering, 10 s)

+300

°C

(1)

Operation outside the Absolute Maximum Ratings may cause permanent device damage. Absolute Maximum Ratings do not imply

functional operation of the device at these or any other conditions beyond those listed under Recommended Operating Conditions. If

outside the Recommended Operating Conditions but within the Absolute Maximum Ratings, the device may not be fully functional, and

this may affect device reliability, functionality, performance, and shorten the device lifetime.

(2)

All voltages are with respect to GND. Currents are positive into, negative out of the specified terminal.

8.2 Handling Ratings

MIN

MAX

UNIT

Tstg

Storage temperature range

–65

150

°C

V(ESD)

Electrostatic discharge

Human body model (HBM), per ANSI/ESDA/JEDEC JS-001, all

pins(1)

2000

V

Charged device model (CDM), per JEDEC specification

JESD22-C101, all pins(2)

500

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2)

JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

8.3 Recommended Operating Conditions

MIN

TYP

MAX

UNIT

Supply Voltage, VDD

4.25

12

14.5

V

Supply bypass capacitance

1

µF

Reference bypass capacitance

0.22

Operating junction temperature

-40

105

°C

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UCD7100

SLUS651E – MARCH 2005 – REVISED NOVEMBER 2021

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