www.ti.com

EXAMPLE BOARD LAYOUT

6X (0.35)

(R0.05) TYP

0.05 MAX

ALL AROUND

0.05 MIN

ALL AROUND

7X (0.5)

8X (0.175)

(0.9)

(0.6)

X2SON - 0.4 mm max height

DQE0008A

PLASTIC SMALL OUTLINE - NO LEAD

4225204/A 08/2019

NOTES: (continued)

4. This package is designed to be soldered to a thermal pad on the board. For more information, see Texas Instruments literature

number SLUA271 (www.ti.com/lit/slua271).

SYMM

SYMM

LAND PATTERN EXAMPLE

EXPOSED METAL SHOWN

SCALE: 40X

SEE SOLDER MASK

DETAIL

1

4

5

8

METAL EDGE

SOLDER MASK

OPENING

EXPOSED METAL

METAL UNDER

SOLDER MASK

SOLDER MASK

OPENING

EXPOSED

METAL

NON SOLDER MASK

DEFINED

(PREFERRED)

SOLDER MASK DEFINED

SOLDER MASK DETAILS