Thermal Characteristics

Parameter

Symbol

Values

Unit

min.

typ.

max.

Characteristics

Thermal resistance, junction - case

RthJC

1.2

K/W

Thermal resistance, junction - ambient, leaded

RthJA

100

SMD version, device on PCB:

@ min. footprint

@ 6 cm2 cooling area 1)

RthJA

75

50

Electrical Characteristics, at Tj= 25 °C, unless otherwise specified

Parameter

Symbol

Values

Unit

min.

typ.

max.

Static Characteristics

Drain- source breakdown voltage

VGS = 0 V, ID = -250 µA

V(BR)DSS

-60

V

Gate threshold voltage, VGS = VDS

ID = -1.7 mA

VGS(th)

-2.1

-3

-4

Zero gate voltage drain current

VDS = -60 V, VGS = 0 V, Tj = 25 °C

VDS = -60 V, VGS = 0 V, Tj = 150 °C

µA

-1

-100

IDSS

-0.1

-10

Gate-source leakage current

IGSS

-10

-100

VGS = -20 V, VDS = 0 V

nA

Drain-source on-state resistance

VGS = -10 V, ID = -21.5 A

RDS(on)

69

75

2

Rev:2023A2

m

Ω

SPD30P06

-60V P-Channel MOSFET