TPD2015FN

2022-03-15

7

© 2022

Toshiba Electronic Devices & Storage Corporation

8. Absolute Maximum Ratings

Table 8.1

Absolute Maximum Ratings

(Ta = 25°C unless otherwise specified)

Characteristics

Symbol

Rating

Unit

Supply voltage

VDD

−0.3 to 40.0

V

Input voltage

VIN

−0.3 to 6.0

V

VDDx - OUTx withstand voltage

VDSS

50.0

1)

V

Output current

IOUT

Internally limited

A

Power dissipation

PD

1.8

W

Operating temperature

Topr

−40 to 110

°C

Junction temperature

Tj

150

°C

Storage temperature

Tstg

−55 to 150

°C

1) Not subject to production test.

Note:

Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the

significant change in temperature, etc.) may cause this product to decrease in the reliability significantly

even if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute

maximum ratings and the operating ranges.

Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook

(“Handling Precautions”/“Derating Concept and Methods”) and individual reliability data (i.e. reliability

test report and estimated failure rate, etc).

8.1. Thermal Resistance

Table 8.2

Thermal resistance

Characteristics

Symbol

Rating

Unit

Thermal resistance

( junction-to-ambient )

Rth (j–a)

70

°C / W

Note:

JEDEC Standard.

Glass epoxy board

Material: FR-4(4 layer)

Board size: 76.2mm x 114.3mm x 1.6mm