Document Number: 91364

www.vishay.com

Revision: 15-Sep-08

1

Package Information

Vishay Siliconix

TO-263AB (HIGH VOLTAGE)

Notes

1. Dimensioning and tolerancing per ASME Y14.5M-1994.

2. Dimensions are shown in millimeters (inches).

3. Dimension D and E do not include mold flash. Mold flash shall not exceed 0.127 mm (0.005") per side. These dimensions are measured at the

outmost extremes of the plastic body at datum A.

4. Thermal PAD contour optional within dimension E, L1, D1 and E1.

5. Dimension b1 and c1 apply to base metal only.

6. Datum A and B to be determined at datum plane H.

7. Outline conforms to JEDEC outline to TO-263AB.

5

4

1

3

L1

L2

D

B

B

E

H

B

A

Detail A

A

A

c

c2

A

2 x e

2 x b2

2 x b

0.010

A

B

MM

± 0.004

B

M

Base

metal

Plating

b1, b3

(b, b2)

c1

(c)

Section B - B and C - C

Scale: none

Lead tip

4

34

(Datum A)

2

C

C

B

B

5

5

View A - A

E1

D1

E

4

4

B

H

Seating plane

Gauge

plane

0° to 8°

Detail “A”

Rotated 90° CW

scale 8:1

L3

A1

L4

L

MILLIMETERS

INCHES

MILLIMETERS

INCHES

DIM.

MIN.

MAX.

MIN.

MAX.

DIM.

MIN.

MAX.

MIN.

MAX.

A

4.06

4.83

0.160

0.190

D1

6.86

-

0.270

-

A1

0.00

0.25

0.000

0.010

E

9.65

10.67

0.380

0.420

b

0.51

0.99

0.020

0.039

E1

6.22

-

0.245

-

b1

0.51

0.89

0.020

0.035

e

2.54 BSC

0.100 BSC

b2

1.14

1.78

0.045

0.070

H

14.61

15.88

0.575

0.625

b3

1.14

1.73

0.045

0.068

L

1.78

2.79

0.070

0.110

c

0.38

0.74

0.015

0.029

L1

-

1.65

-

0.066

c1

0.38

0.58

0.015

0.023

L2

-

1.78

-

0.070

c2

1.14

1.65

0.045

0.065

L3

0.25 BSC

0.010 BSC

D

8.38

9.65

0.330

0.380

L4

4.78

5.28

0.188

0.208

ECN: S-82110-Rev. A, 15-Sep-08

DWG: 5970