ADUM7703_V01 datasheet(8/22 Pages) AD

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ADuM7703

Data Sheet

Rev. A | Page 8 of 22

ABSOLUTE MAXIMUM RATINGS

TA = 25°C, unless otherwise noted. All voltages are relative to

the respective GNDx.

Table 8.

Parameter

Rating

VDD1 to GND1

−0.3 V to +23 V

VDD2 to GND2

−0.3 V to +6 V

Analog Input Voltage to GND1

−1 V to +4.3 V

Digital Input Voltage to GND2

−0.5 V to VDD2 + 0.5 V

Digital Output Voltage to GND2

−0.5 V to VDD2 + 0.5 V

Input Current to Any Pin Except Supplies1

±10 mA

Output Current from Any Pin Except

Supplies

±10 mA

Operating Temperature Range

16-lead SOIC_W

−40°C to +125°C

8-lead SOIC_IC

−40°C to +105°C

Storage Temperature Range

−65°C to +150°C

Junction Temperature

150°C

Pb-Free Temperature, Soldering

Reflow

260°C

Electrostatic Discharge (ESD)

Field Induced Charged Device Model

(FICDM)2

±1250 V

Human Body Model (HBM)3

±4000 V

1 Transient currents of up to 100 mA do not cause silicon controlled rectifier

(SCR) to latch up.

2 JESD22-C101, resistor, capacitor (RC) network, 1 Ω, package capacitance, and

Class IV.

3 ESDA/JEDEC JS-001-2011, RC network: 1.5 kΩ, 100 pF, and Class 3A.

Stresses at or above those listed under Absolute Maximum

Ratings may cause permanent damage to the product. This is a

stress rating only; functional operation of the product at these

or any other conditions above those indicated in the operational

section of this specification is not implied. Operation beyond

the maximum operating conditions for extended periods may

affect product reliability.

THERMAL RESISTANCE

Thermal performance is directly linked to printed circuit board

(PCB) design and operating environment. Close attention to

PCB thermal design is required.

Table 9. Thermal Resistance

Package Type1

θJA2

ΨJC3

Unit

RI-8-1

105

9.25

°C/W

RW-16

87.25

10.4

°C/W

1 Thermal impedance simulated values are based on a JEDEC 2S2P thermal

test board. See JEDEC JESD-51.

2 θJA was calculated using the total power and maximum junction

temperature.

3 ΨJC was calculated using the package center case temperature.

ESD CAUTION

INSULATION RATINGS

The maximum continuous working voltage refers to the continuous voltage magnitude imposed across the isolation barrier. See the

Insulation Lifetime section for more details.

Table 10. Maximum Continuous Working Voltage

Parameter

Insulation Rating1

Lifetime Conditions

Basic Insulation

AC Voltage

Bipolar Waveform

1129 VPEAK

20 years to 1000 ppm failure at 1129 VPEAK (798 V rms, 50 Hz or 60 Hz sine wave)

Reinforced Insulation

AC Voltage

Bipolar Waveform

1060 VPEAK

20 years to 1 ppm failure at 1060 VPEAK (750 V rms, 50 Hz or 60 Hz sine wave)

1 Insulation capability without regard to creepage limitations. Working voltage may be limited by the PCB creepage when considering rms voltages for components

soldered to a PCB (assumes Material Group I up to 1270 V rms), or package: RI-8-1 package creepage of 8.1 mm, and RW-16 package creepage of 7.8 mm, when

considering rms voltages for Material Group I.

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